(Rapidus US)Senior Customer Package Design Integration Engineer (2.5D / 3D Packaging)
- 職務内容
- We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer chiplet-based product development using Rapidus advanced packaging technologies.
This role serves as the primary technical and program interface between Rapidus and customers, integrating ADKs (Assembly Design Kits), packaging technologies, and customer design activities into a unified, successful outcome.
You will combine deep expertise in 2.5D/3D packaging and chiplet integration with strong program management and cross-functional coordination skills to drive customer designs from bring-up through tape-out in a rapidly evolving technology environment.
Key Responsibilities:
Customer Design Integration & Enablement
-Lead customer design bring-up using Rapidus Assembly Design Kits (ADKs)
-Guide customers in effectively applying:
-Package design rules, libraries, and interface definitions
-Interposer and substrate architectures
-SI/PI/thermal design methodologies
-Provide technical guidance on chiplet integration, including HBM, UCIe, PCIe, and high-speed SerDes
Program Execution & Delivery Ownership
-Drive customer projects toward successful 2.5D/3D package design tape-out and product realization:
-Manage:
Design schedules and milestones
-Risks, issues, and dependencies
-Cross-functional action items
-Lead regular technical and program reviews with customers and internal teams
Cross-functional Integration (Core Responsibility)
-Act as the central coordination point across:
-Customer engineering teams
-Package Design Engineering
-ADK / Enablement teams
-Process, manufacturing, and OSAT partners
-Translate Rapidus technology updates into clear, actionable guidance for customers
-Ensure alignment between design assumptions and manufacturing capabilities
Technical Issue Resolution
-Support debugging and issue resolution in areas such as:
-SI/PI and signal integrity challenges
-Package layout and routing issues
-ADK usage and interpretation
-Drive root-cause analysis and coordinate solution deployment across teams
Continuous Improvement & Ecosystem Feedback
-Capture customer feedback and drive improvements in:
-ADK quality and usability
-Design methodologies and flows
-Documentation and training materials
-Contribute to strengthening the chiplet ecosystem and customer readiness
What You Will Impact :
-Ensure successful customer design execution and tape-out delivery
-Bridge the gap between ADK (Assembly Design Kit: design environment) and real product realization
-Integrate design, technology, and execution into a coherent development flow
-Accelerate customer adoption of Rapidus advanced packaging technologies at 2nm and beyond
What We Offer :
-Opportunity to play a critical role in customer success for next-generation chiplet platforms
-Work at the intersection of technology, execution, and system integration
-Collaboration with global teams across the US and Japan
-Competitive compensation and career growth opportunities - 応募資格/応募条件
- Required Qualifications :
-B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related field
-5+ years of experience in semiconductor packaging, system design, or customer-facing engineering roles
-Strong understanding of:
-2.5D / 3D packaging (interposer, TSV, hybrid bonding, RDL/fan-out)
-High-speed interfaces (HBM, PCIe, UCIe, SerDes)
-Hands-on experience with package design and analysis tools (Cadence, Ansys, Synopsys, etc.)
-Proven ability to manage complex technical programs and cross-functional activities
-Strong communication skills with customer-facing experience
Preferred Qualifications :
-Experience in foundry, OSAT, or semiconductor customer support roles
-Familiarity with ADK / PDK and design enablement flows
-Experience with die-package-system co-design methodologies
-Background in HPC, AI, or networking systems
-Experience in silicon bring-up, validation, or failure analysis
-Knowledge of advanced substrates (ABF, glass core, fan-out RDL)
-Japanese language skills for collaboration with Japan-based customers
- 雇用形態
- Probational period: 3 months (conditions of the employment remains the same)
- 給与
- The exact salary will be determined based on qualifications, experience and location.
- 昇給
- Potential for career growth based on performance and company needs.
- 勤務地
- Albany, NY (USA) / Santa Clara, CA (USA) / Tokyo (Japan) / Chitose (Japan)
- 勤務時間
- Flex time: 40 hours weekly with start and end times between 9 am and 5:30 pm. 1 hour lunch break.
- 休日休暇
- We observe these paid holidays: New Year’s Day, Memorial Day, Independence Day, Labor Day, Thanksgiving, the day after Thanksgiving, and Christmas. We observe founding anniversary (8/10) and employees may take personal holidays of their choice (up to 4 days, depends on the start date).
Paid Sick Leave based on NYS law
PTO: front loaded, max 20 days/year - 加入保険
- Medical, Dental, Vision, 401(k) benefits are provided.
- 待遇・手当
- n/a
- 各種制度
- We offer comprehensive on-the-job training to ensure your success.
- 応募書類
- Applicants must submit a current resume to be considered for this position.
- その他
- We are a smoke-free workplace in accordance with company policy and local regulations.
- 選考プロセス
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以下はモデルケースですので、面接回数など若干変更する場合もあります。
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STEP 1STEP 1 Web Entry
Please apply via the entry form.
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STEP 2STEP 2 Document Screening
We will review your application based on the information provided.
Regardless of the result, we will notify you of the outcome. -
STEP 3STEP 3 First Interview
Conducted online.
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STEP 4STEP 4 Final Interview
Conducted online. There will be confirmation items.
Depending on the position, the number of interviews may not be limited to two.
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STEP 5STEP 5 Job Offer
Your application will be kept strictly confidential.
The information provided will only be used for the purpose of the selection process.
It generally takes about 2–3 weeks from document screening to job offer.
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- お問い合わせ
- Rapidus株式会社
東京都千代田区麹町4丁目1番地 麹町ダイヤモンドビル 11階
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