(Rapidus US)Senior Assembly Design Kit (ADK) Development Engineer (2.5D/3D Advanced Packaging)
- 職務内容
- We are seeking a highly skilled ADK (Assembly Design Kit) Development Engineer to lead the creation, integration, and validation of design enablement infrastructure for 2.5D/3D advanced packaging, including chiplet-based architectures, silicon interposers, and heterogeneous integration technologies. This role is central to enabling next‑generation multi‑die systems by delivering robust ADKs that bridge design, manufacturing, and EDA ecosystems.
You will collaborate closely with packaging R&D, process integration, EDA vendors, IP partners, and customer design teams across multiple global sites.
Key Responsibilities;
-Develop and maintain Assembly Design Kits (ADKs) for 2.5D/3D packaging technologies, including:
-Package assembly rules
-DRC/LVS rule decks
-Bump/TSV/RDL design constraints
-Thermal/mechanical design guidelines
-Multi-die floorplanning and connectivity models
-Define and implement design methodologies for chiplet-based and heterogeneous integration flows.
-Work with EDA vendors (Cadence, Synopsys, Siemens) to enable:
-3DIC design flows
-System-level co-design (package + die)
-Parasitic extraction and signal/power integrity analysis
-Validate ADK quality through:
-Reference design creation
-Automated regression testing
-Cross-tool consistency checks
-Collaborate with process and packaging engineering teams to translate manufacturing constraints into design rules.
-Support customer design teams by providing technical guidance, documentation, and issue resolution.
-Drive continuous improvement of ADK architecture, automation, and release processes.
What We Offer :
-Opportunity to shape the design ecosystem for next-generation 2.5D/3D semiconductor technologies.
-Collaboration with world-class R&D teams across the US and Japan.
-Competitive compensation and benefits.
-A fast-moving environment where innovation and technical leadership are valued. - 応募資格/応募条件
- Required Qualifications :
-Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Materials Science, or related field.
-5+ years of experience in advanced packaging, 3DIC, package design, or design enablement.
-Strong knowledge of:
-2.5D/3D packaging technologies (interposers, chiplets, hybrid bonding, TSV, RDL)
-Package design flows using Cadence SIP/Allegro, Synopsys 3DIC Compiler, or Siemens Xpedition
-DRC/LVS rule development and verification
-Hands-on experience with scripting languages (Python, Tcl, SKILL, etc.) for automation.
-Understanding of SI/PI/thermal analysis methodologies.
-Excellent communication skills and ability to work with cross-functional global teams.
Preferred Qualifications
-Experience developing PDKs/ADKs or design kits for foundry or OSAT environments.
-Knowledge of heterogeneous integration standards (UCIe, BoW, HBM).
-Familiarity with chiplet architecture and multi-die system design.
-Experience with packaging manufacturing processes (RDL, micro-bump, hybrid bonding).
-Ability to lead technical discussions with customers and ecosystem partners. - 雇用形態
- Probational period: 3 months (conditions of the employment remains the same)
- 給与
- The exact salary will be determined based on qualifications, experience and location.
- 昇給
- Potential for career growth based on performance and company needs.
- 勤務地
- Albany, NY (USA) / Santa Clara, CA (USA) / Tokyo (Japan) / Chitose (Japan)
- 勤務時間
- Flex time: 40 hours weekly with start and end times between 9 am and 5:30 pm. 1 hour lunch break.
- 休日休暇
- We observe these paid holidays: New Year’s Day, Memorial Day, Independence Day, Labor Day, Thanksgiving, the day after Thanksgiving, and Christmas. We observe founding anniversary (8/10) and employees may take personal holidays of their choice (up to 4 days, depends on the start date).
Paid Sick Leave based on NYS law
PTO: front loaded, max 20 days/year - 加入保険
- Medical, Dental, Vision, 401(k) benefits are provided.
- 待遇・手当
- n/a
- 各種制度
- We offer comprehensive on-the-job training to ensure your success.
- 応募書類
- Applicants must submit a current resume to be considered for this position.
- その他
- We are a smoke-free workplace in accordance with company policy and local regulations.
- 選考プロセス
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以下はモデルケースですので、面接回数など若干変更する場合もあります。
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STEP 1STEP 1 Web Entry
Please apply via the entry form.
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STEP 2STEP 2 Document Screening
We will review your application based on the information provided.
Regardless of the result, we will notify you of the outcome. -
STEP 3STEP 3 First Interview
Conducted online.
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STEP 4STEP 4 Final Interview
Conducted online. There will be confirmation items.
Depending on the position, the number of interviews may not be limited to two.
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STEP 5STEP 5 Job Offer
Your application will be kept strictly confidential.
The information provided will only be used for the purpose of the selection process.
It generally takes about 2–3 weeks from document screening to job offer.
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- お問い合わせ
- Rapidus株式会社
東京都千代田区麹町4丁目1番地 麹町ダイヤモンドビル 11階
採用担当
