{"id":1777,"date":"2026-10-05T11:00:00","date_gmt":"2026-10-05T02:00:00","guid":{"rendered":"https:\/\/www.rapidus.inc\/?post_type=news_topics&p=1777"},"modified":"2026-10-05T11:27:56","modified_gmt":"2026-10-05T02:27:56","slug":"20261005-2","status":"publish","type":"news_topics","link":"https:\/\/www.rapidus.inc\/en\/news_topics\/information\/20261005-2\/","title":{"rendered":"Rapidus Unveils \u201cRapidus CORE\u201d, New Global Ecosystem Framework Supporting the Development and Mass Production of Cutting-Edge Semiconductors ~ As part of its first phase, Rapidus is announcing the formation of Design Solution Associates to help customers support early-stage design for Rapidus\u2019 advanced 2nm semiconductor foundry~z<\/span>"},"content":{"rendered":"\n

TOKYO, Oct. 5, 2026<\/strong> \u2013 Rapidus Corporation<\/a> today announced that it will establish the Rapidus Collaborative Open Rapid Ecosystem (CORE), a global ecosystem framework to support the development and mass production of cutting-edge semiconductors.<\/p>\n\n\n

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Today, semiconductor development requires more than just manufacturing technology; it is essential to integrate the entire semiconductor value chain \u2014including research institutions, EDA, IP, design and manufacturing \u2014 to provide customers with a development and production infrastructure they can rely on. Further, amid a global shortage of cutting-edge semiconductor talent, it is crucial to build a design ecosystem that enables customers to begin development at an early stage by collaborating with design-related companies.<\/p>\n\n\n\n

As the first Rapidus CORE initiative, Rapidus is announcing the formation of Design Solution Associates, a group of design companies. Design Solution Associates will serve as a bridge between customers and Rapidus, providing each company\u2019s design resources and specialized expertise to support the rapid evolution of semiconductor development. This will enable Rapidus to strengthen its support system \u2014 from design through manufacturing \u2014 to meet customer needs both in Japan and overseas.<\/p>\n\n\n\n

The 17 Design Solution Associates announced today are as follows, in alphabetical order: AION Silicon Limited; Cadence Design Systems, Inc.; Dai Nippon Printing Co., Ltd.; GreatAsic Technology Sdn. Bhd.; HCL Technologies Limited; Infinecs Systems Sdn. Bhd.; Infosys Limited; MavissDesign Co., Ltd.; MosChip Technologies Limited; NSW Inc.; Oppstar Technology Sdn Bhd; Quest Global Services Pte. Ltd.; SkyeChip Berhad; Synopsys, Inc.; TOPPAN Inc.; Toshiba Information Systems (Japan) Corporation and Wipro Limited.<\/p>\n\n\n\n

Moving forward, Rapidus will expand its CORE offerings beyond design to include EDA, IP and other categories. By strengthening partnerships with companies in each of these categories, Rapidus will help accelerate the global ecosystem that supports the development and mass production of cutting-edge semiconductors.<\/p>\n\n\n\n

About Rapidus Corporation<\/strong>
Rapidus Corporation aims to develop and manufacture the world’s most advanced logic semiconductors. We will create new industries together with our customers through the development and provision of services to shorten cycle times in design, wafer processes, 3D packaging and more. We will continue to challenge ourselves in order to contribute to the fulfillment, prosperity and happiness of people\u2019s lives through the use of semiconductors. Visit: https:\/\/www.rapidus.inc\/en\/<\/a><\/p>\n\n\n\n

Rapidus Corporation<\/strong>
Headquarters: 4-1 Kojimachi, Chiyoda-ku, Tokyo 102-0083, Japan
Founded: August 10, 2022
Business Areas: Development, design, manufacture, and sale of semiconductor devices, integrated circuits and other electronic components
Capital (as of June 5, 2026): 424.95 billion yen (including legal capital surplus)<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

U.S. Media Contact:
Breakaway Communications for Rapidus
Email: rapidus@breakawaycom.com<\/p>\n\n\n\n

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