{"id":1005,"date":"2024-06-05T13:00:24","date_gmt":"2024-06-05T04:00:24","guid":{"rendered":"https:\/\/www.rapidus.inc\/wp\/?post_type=news_topics&#038;p=1005"},"modified":"2024-12-06T13:25:36","modified_gmt":"2024-12-06T04:25:36","slug":"rapidus-signs-comprehensive-collaboration-agreement-with-hokkaido-university-en","status":"publish","type":"news_topics","link":"https:\/\/www.rapidus.inc\/en\/news_topics\/information\/rapidus-signs-comprehensive-collaboration-agreement-with-hokkaido-university-en\/","title":{"rendered":"Rapidus Signs Comprehensive Collaboration Agreement with Hokkaido University<span>Goal is to enhance Japan\u2019s scientific and technological capabilities, and develop human resources for the semiconductor industry<\/span>"},"content":{"rendered":"\n<p><\/p>\n\n\n\n<p><strong>June 5, 2024<\/strong> \u2013 Rapidus Corporation (Head Office: 4-1 Kojimachi, Chiyoda-ku, Tokyo; President and CEO: Atsuyoshi Koike) today announced that it has signed a comprehensive collaboration agreement for education and research with Hokkaido University (Kita 8, Nishi 5, Kita-ku, Sapporo, Hokkaido; President: Kiyohiro Houkin). The purpose of this agreement is to contribute to the enhancement of Japan&#8217;s scientific and technological capabilities and develop human resources for the semiconductor industry.<\/p>\n\n\n\n<p>Hokkaido is rapidly supporting the growth of Japan\u2019s semiconductor industry, facilitating human resource development and research and development (R&amp;D). With Rapidus&#8217; pilot line to begin operation in April 2025 with mass production in 2027, the two parties have committed to a comprehensive collaboration agreement for the purpose of promoting long-term cooperation in the development of high-level human resources and advanced semiconductor research.<\/p>\n\n\n\n<p>The details of collaboration and cooperation are:<\/p>\n\n\n\n<p>(1) Training and education of semiconductor-related human resources<br>(2) Research cooperation in advanced semiconductor research, etc.<br>(3) Use of facilities and equipment<br>(4) Other matters as agreed upon and deemed necessary to achieve the objectives of this agreement<\/p>\n\n\n\n<p>A base will be established on the campus of Hokkaido University by the end of 2024 where Rapidus will evaluate and analyze 2nm semiconductors. The companies will promote R&amp;D projects for advanced semiconductors and Rapidus will also participate in advanced semiconductor research that takes advantage of the unique research features from Hokkaido University.<\/p>\n\n\n\n<p>Regarding semiconductor-related human resource development, Rapidus plans to dispatch its engineers to Hokkaido University to give lectures while Hokkaido University plans to provide Rapidus engineers with opportunities to learn about its latest research results.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" width=\"1024\" height=\"683\" src=\"https:\/\/www.rapidus.inc\/wp\/wp-content\/uploads\/2024\/06\/202405051-1024x683.png\" alt=\"\" class=\"wp-image-1013\" srcset=\"https:\/\/www.rapidus.inc\/wp\/wp-content\/uploads\/2024\/06\/202405051-1024x683.png 1024w, https:\/\/www.rapidus.inc\/wp\/wp-content\/uploads\/2024\/06\/202405051-300x200.png 300w, https:\/\/www.rapidus.inc\/wp\/wp-content\/uploads\/2024\/06\/202405051-768x512.png 768w, https:\/\/www.rapidus.inc\/wp\/wp-content\/uploads\/2024\/06\/202405051.png 1200w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><figcaption class=\"wp-element-caption\">At the signing ceremony for the Comprehensive Collaborative Agreement held on June 5, 2024, at Hokkaido University. From left to right: Kiyohiro Houkin, President, Hokkaido University, and Atsuyoshi Koike, President and CEO, Rapidus Corporation.<\/figcaption><\/figure>\n\n\n\n<p><br><\/p>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>About Hokkaido University<\/strong><\/h4>\n\n\n\n<p>Hokkaido University has developed as the only university in the vast land of Hokkaido with four basic philosophies of education and research: \u201cFrontier Spirit,\u201d \u201cGlobal Perspectives,\u201d \u201cAll-round Education,\u201d and \u201cPractical Learning.\u201d We will establish the \u201cNovel Japan University Model,\u201d a new Japanese university model that creates a large social impact from solving global problems and move forward strongly toward realizing the world&#8217;s common goal of a &#8220;sustainable well-being society.&#8221;<\/p>\n\n\n\n<div style=\"border:1px solid #333;padding:20px;margin-bottom:30px;\">\nNational University Corporation, Hokkaido University<br>\n\n<div class=\"flexli\"><span>Location: <\/span>\n<span>Kita 8, Nishi 5, Kita-ku, Sapporo, Hokkaido\n<\/span>\n<\/div>\n<div class=\"flexli\"><span>Founded: <\/span>\n<span>August 14, 1876 (as Sapporo Agricultural College)<\/span>\n<\/div>\n\n<div class=\"flexli\"><span>President: <\/span>\n<span>Kiyohiro Houkin<\/span>\n<\/div>\n<\/div>\n\n\n\n<p><br><\/p>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>About Rapidus Corporation<\/strong><\/h4>\n\n\n\n<p>Rapidus Corporation aims to develop and manufacture the world&#8217;s most advanced logic semiconductors. We will create new industries together with our customers through the development and provision of services to shorten cycle times in design, wafer processes, 3D packaging, and more. We will continue to challenge ourselves in order to contribute to the fulfillment, prosperity, and happiness of people\u2019s lives through the use of semiconductors.<\/p>\n\n\n\n<div style=\"border:1px solid #333;padding:20px;margin-bottom:30px;\">\n\nHeadquarters: 4-1 Kojimachi, Chiyoda-ku, Tokyo 102-0083, Japan<br>\nFounded: August 10, 2022<br>\n<div class=\"flexli\"><span>Management: <\/span>\n<span>Tetsuro Higashi, Chairman of the Board of Directors<br>\nAtsuyoshi Koike, President and CEO\n<\/span>\n<\/div>\n<div class=\"flexli\"><span>Business Areas: <\/span>\n<span>Research, development, design, manufacture, and sales of semiconductor devices, integrated circuits and other electronic components<\/span>\n<\/div>\n\n<div class=\"flexli\"><span>Capital (as of November 2022): <\/span>\n<span>7,346 million yen (includes capital reserves)<\/span>\n<\/div>\n<\/div>\n\n\n\n<p><br><\/p>\n\n\n\n<p><strong>Media contacts (Rapidus Corporation):<\/strong><\/p>\n\n\n\n<p>Kreab K.K.<\/p>\n\n\n\n<p>Kunihiko Yasue, E-mail: <a href=\"mailto:kyasue@kreab.com\">kyasue@kreab.com<\/a><br>Takano Okumoto, E-mail: <a href=\"mailto:tokumoto@kreab.com\">tokumoto@kreab.com<\/a><br>Miki Yagi, E-mail: <a href=\"mailto:myagi@kreab.com\">myagi@kreab.com<\/a><\/p>\n\n\n\n<p><br><\/p>\n\n\n\n<p><strong>Media contact (Hokkaido University):<\/strong><\/p>\n\n\n\n<p>Atsushi Ueda, Office for Promotion of Semiconductor Hub Formation,<br>Planning Division, General Affairs and Planning Department<br>Email: <a href=\"mailto:semicon-jimu@general.hokudai.ac.jp\">semicon-jimu@general.hokudai.ac.jp<\/a><\/p>\n","protected":false},"featured_media":1136,"parent":0,"menu_order":0,"template":"","news_cat":[9],"class_list":["post-1005","news_topics","type-news_topics","status-publish","has-post-thumbnail","hentry","news_cat-information","en-US"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ 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