{"version":"1.0","provider_name":"Rapidus\u682a\u5f0f\u4f1a\u793e","provider_url":"https:\/\/www.rapidus.inc","author_name":"noboru.shibata@rapidus.co.jp","author_url":"https:\/\/www.rapidus.inc\/author\/noboru-shibatarapidus-co-jp\/","title":"Rapidus Corporation","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"zbJmGcHuN3\"><a href=\"https:\/\/www.rapidus.inc\/en\/news_topics\/information\/20260615-2\/\">Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing<span>New collaboration provides framework between the Japan government and the UK<\/span><\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.rapidus.inc\/en\/news_topics\/information\/20260615-2\/embed\/#?secret=zbJmGcHuN3\" width=\"600\" height=\"338\" title=\"&#8220;Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing&lt;span&gt;New collaboration provides framework between the Japan government and the UK&lt;\/span&gt;&#8221; &#8212; Rapidus\u682a\u5f0f\u4f1a\u793e\" data-secret=\"zbJmGcHuN3\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script>\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/www.rapidus.inc\/wp\/wp-includes\/js\/wp-embed.min.js\n<\/script>\n","description":"TOKYO, June 15, 2026 \u2013 Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the UK Semiconductor Centre (UKSC), a national body promoting the semiconductor industry in the UK, for future semiconductor manufacturing. The UKSC supports the development of the country\u2019s semiconductor ecosystem and growth strategies, as well as promotes international [&hellip;]"}